Dongguan sunny Electronic Technology Co., Ltd.   

Characteristics: submicron fiber dust-free cloth is made by laser or ultrasonic chip sealing, after 10-100 level purification room through ultra pure water washing, vacuum packaging. The material is extremely soft and has no harm to the surface of the swab. Even in high precision areas, such as coated lenses and large scale integrated circuits, it can be used safely. The unique high density weaving structure makes the specific surface area of each gram microfiber clean cloth reach 200m2, and the dust absorption increases several times. Ultrafine fiber, excellent capillary effect and fast drying become one of its remarkable characteristics. The high strength synthetic filament is not easy to break, and the fibers are not easy to fall off the clean cloth, and there is no pollution in the clean area. Laser cutting and ultrasonic cutting have unique cutting and melting effect. They completely solve the problem of dust emission on the edge and maximize the quality of the product. It is the most advanced cutting edge sealing method.



Scope of application: semiconductor production line, microprocessor, aviation manufacturing and maintenance, laboratory, electronics industry, computer assembly, optical instrument manufacturing, LCD liquid crystal display, precision instrument, optical product and circuit board production line, etc. it is especially suitable for the 10 class -100 level purification plant produced by semiconductor industry and electronics industry.

The model is as follows:
Name Item size Size 4 "package Package 6" /9 "packaging Package weight g/m2
KX-2*** 4 "/ 6" /9 "400pcs/ package 100pcs/ package 100~200
KX-3*** 4 "/ 6" /9 "400pcs/ package 100pcs/ package 100~200
KX-4*** 4 "/ 6" /9 "400pcs/ package 100pcs/ package 100~200
KX-5*** 4 "/ 6" /9 "400pcs/ package 100pcs/ package 100~200


It can be customized according to customer demand.