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Shenzhen Xinye electronic application material Co., Ltd.    No Member

Shenzhen Xinye electronic application material Co., Ltd. Brand
Business Model
Founded
Introduction
        DP460    double component structure with glue, 3M-EPX glue gun sizing, room temperature curing, overlap shear strength can reach 4500psi, 2-4 hours to achieve the operating strength, long operation time and tough epoxy resin. Void fill properties makes not enough close two surface firmly the glued together. Suitable for many kinds of adhesive material. Our long-term sale of 3M      Sony Japanese DIC tape TESA;   3M  Sony Japan three healthy glue   Cai Sheng 13826534077  contact: Miss Huang: 15889433910
Main Products
Contact information
Contact:   Mr. Cai Sheng
Tel:  
Addr:       China Guangdong Shenzhen City manhole town Xinle Baoan District Xin Er Cun Ju Garden D4 block 101