Suzhou Mingtai Electronic Equipment Co., Ltd.   

        surface mount technology (Surface mounting Technology, referred to as SMT) because of its high mounting density and good automation production and the high speed development and assembly is widely used in the production of circuit. SMT is the fourth generation of electronic assembly technology, its advantage is the installation of components of high density, easy to realize automation and improve production efficiency, reduce the cost of. SMT production line is composed of screen printing, mount components and reflow three processes form, as shown in figure 1. The SMC / SMD (surface mount component / Surface mount device, chip electronic components / devices) of the mount is an important part of the surface mount process, it relates to the problem than the other processes are more complex, more difficult, and chip electronic components mounting equipment in the whole equipment investment is the biggest.
with the current development of electronic products to the portable, miniaturization direction, the corresponding SMC / SMD also to the small size of the development, but also to meet the IC chip functional requirements, and the use of multi wire and fine pitch. Small refers to the size miniaturization mount components, it experienced a process: 3225 - 3216 - 2520 - 2125 - 1608 - 1003 - 1603 - 0402 - 0201. Mount QFP pin spacing from 1.27 - 0.635 - 0.5 - 0.4 - 0.3 mm will provide more fine pitch development, but due to the limited processing speed component lead frame, QFP spacing limit is 0.3 mm, so in order to meet the demand of high density packaging, appeared superior performance than the QFP BGA (Ball Grid Array), CSP (Chip Size Package), COB (Chip On Board) and Flip Chip bare chip.
chip electronic component mounting device (commonly known as Mounter) as one of the key equipment of the electronics industry, the use of fully automatic SMT technology, can effectively improve the production efficiency, reduce the manufacturing cost (1) (2). With the increasing miniaturization of electronic components and electronic device with multi pin, fine pitch trend, requirements of precision and speed on the placement machine is more and more high, but the accuracy and speed of the high speed tradeoff is needed, the general high speed mounter is often at the expense of accuracy at the cost of. The working principle of
Mounter mounter
2 is actually a kind of precision industrial robot is a complex machine, electric light and computer control technology. It is through absorbing the displacement functions of location placed, in does not damage the components and printed circuit board case, realizes SMC / SMD components accurately and quickly mount to the pads on the specified position of PCB board. Element to have machinery of laser on the vision of,, in 3 ways. The patch is composed of a machine frame, x y mechanism (ball screw, linear guide rail, a drive motor), mount head components, feeder, PCB bearing mechanism, device for detecting device, the computer control system composition, the machine movement mainly is realized by the X Y movement, movement through the ball screw transfer the power, by the linear rolling guide motion pair to realize directional transmission form, such not only its own motion resistance is small, compact structure, and high motion accuracy and effectively ensure the position accuracy of each element mounted paste.
machine in the important components such as Mount spindle, dynamic / static lens, the suction nozzle base, feeder on the Mark logo. Machine vision can automatically find the coordinates of these Mark center system, the establishment of coordinate placement machine system and PCB, the conversion relation between mount element coordinate system, the movement precision coordinates calculated placement machine; mounting head according to the import mount components package types, element number parameters such as position corresponding to grab the suction nozzle, draw element; static shot detection, identification and on to absorb elements according to visual processing program; on the completed mount head component mounted to a predetermined position PCB. This series of elements, in recognition of, detection and mount action is IPC data according to the corresponding command to retrieve the relevant post instruction control system automatically.